Advanced Package and Integrated Chips (Spring 2025)

先进封装与集成芯片

General Info

Instructor: Chixiao Chen, Wenning Jiang

Email: cxchen@fudan.edu.cn, wenningjiang@fudan.edu.cn

Location: JA202, Fudan University (Jiangwan Campus)

Time: Monday Night 18:30 - 21:05 (Begin on March 26, 2023)

Announcement

1. The final project assignment will be annouced on Apr. 21.
2. We will NOT have class on Apr. 27.
3. Homework assignment 2 is released. It will be due on 05/02/2025.
4. In this semaster, we will have two class skipped due to holidays: May 5th (劳动节节), and June 2nd （端午节）.
5. Homework assignment 1 is released. It will be due on 03/30/2025.

Course Calendar

Week	Date	Lecture Title	Slides	Material
1	Feb. 17	Introduction	Lec1	/
2	Feb. 24	2.5D Integration	Lec2	/
3	March. 3	3D Integration	Lec3	/
4	March. 10	Basics of D2D PHY		Instructed By Wenning Jiang
5	March. 17	Silicon Bridge	Lec4	Homework1
6/7	March. 24/31	D2D PHY (Cont’d)	Lec-D2D-A	/
8	Apr. 7	D2D PHY (Cont’d)	Lec-D2D-B	/
9	Apr. 14	SoC & Chiplet Interconnect	Lec8	Homework2
10	Apr. 21	Interconnect & Partition		/
11	Apr. 28	Cost Drivien Partition		/

Reference Material

1. John H. Lau, Chiplet Design and Heterogeneous Integration Packaging – For Fudan Students, you can download the Springer book via institutional access.
2. The World of Advanced Packaging, YouTube Video.
3. ECEN720 from TAMU, High speed wireline links circuit design