Advanced Package and Integrated Chips (Spring 2025)

先进封装与集成芯片

General Info

Instructor: Chixiao Chen, Wenning Jiang

Email: cxchen@fudan.edu.cn, wenningjiang@fudan.edu.cn

Location: JA202, Fudan University (Jiangwan Campus)

Time: Monday Night 18:30 - 21:05 (Begin on March 26, 2023)

Announcement

1. In this semaster, we will have two class skipped due to holidays: May 5th (劳动节节), and June 2nd （端午节）.
2. Homework assignment 1 is released. It will be due on 03/30/2025.

Course Calendar

Week	Date	Lecture Title	Slides	Material
1	Feb. 17	Introduction	Lec1	/
2	Feb. 24	2.5D Integration	Lec2	/
3	March. 3	3D Integration	Lec3	/
4	March. 10	Basics of D2D PHY		Instructed By Wenning Jiang
5	March. 17	Silicon Bridge	Lec4	Homework1
6	March. 24	D2D PHY (Cont’d)		/

Reference Material

1. John H. Lau, Chiplet Design and Heterogeneous Integration Packaging – For Fudan Students, you can download the Springer book via institutional access.
2. The World of Advanced Packaging, YouTube Video.
3. ECEN720 from TAMU, High speed wireline links circuit design