Advanced Package and Integrated Chips (Spring 2024)

先进封装与集成芯片

General Info

Instructor: Chixiao Chen, Wenning Jiang

Email: cxchen@fudan.edu.cn, wenningjiang@fudan.edu.cn

Location: JA204, Fudan University (Jiangwan Campus)

Time: Monday Night 18:30 - 21:05 (Begin on March 26, 2023)

Announcement

1. Course (final project) is released, please check from Lec8, please inform Chixiao of your choice by May 6th. Here is paper selection pool for students choose presentation. The presentation day is first schedule on May 27/ Jun 3. If we cannot finish it, we will find one more day in the week after Jun 10 (Duanwu holiday).
2. Homework 2 is released and will be collected by April. 29th, 2024.
3. Homework 1 is released and will be collected by April. 1st, 2024.
4. March. 10: The class on March 11 will be cancelled because Chixiao is sick and getting cold. I apologize for any inconvenience this may cause.

Course Calendar

Week	Date	Lecture Title	Slides	Material
1	Feb. 26	Introduction	Lec1	/
2	March. 4	RDL, fanout and Silicon Bridge	Lec2	/
3	March. 11	Cancelled	/	/
4	March. 18	TSV and Hybrid Bonding	Lec3	Homework1
5-8	March.25 Apr. 1/8/15	High-Speed Link Circuits and Systems for Chiplet	Lec4-5 Lec6-7	Homework2
9	April. 29	SoC & Chiplet Interconnect	Lec8	/
10	May. 6	Interconnect & Partition	Lec9	/
11	May. 13	Cost Drivien Partition	Lec10	/

Reference Material

1. John H. Lau, Chiplet Design and Heterogeneous Integration Packaging – For Fudan Students, you can download the Springer book via institutional access.
2. The World of Advanced Packaging, YouTube Video.
3. ECEN720 from TAMU, High speed wireline links circuit design